MR18R326GAG0-CT9 КХП, ВЕРИГА, ФУНКЦИЯ
MR18R326GAG0-CT9 Datasheet PDF
| Производител | Опаковка | Описание | Температура | |
|---|---|---|---|---|
| SAMSUNG[Samsung semiconductor] | (32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V |
MR18R326GAG0-CT9 PDF | Мин°C | Макс°C |
- SAMSUNG[Samsung semiconductor] MR18R326GAG0
(32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V - SAMSUNG[Samsung semiconductor] MR18R326GAG0-CM8
(32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V - SAMSUNG[Samsung semiconductor] MR18R326GAG0-CT9
(32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V